FSM’s product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required. They are also needed for double side patterning and device manufacturing projects.
FSM carries a large inventory of double side polished wafers in all wafer diameters ranging from 50mm to 300mm. If your specification is not available in inventory FSM can custom manufacture wafers to your unique specifications. Double Side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry.
Below are examples of FSM standard products:
Silicon Wafer
Diameter: 100mm
Type/dopant: N or P
Orientation: <100>
Resistivity: 0-100 ohm-cm
Thickness: 525 +/-20um
TTV: < 8um
STIR: available upon request
Flats: 1 or 2/ SEMI standard
Double Side Polished | Silicon Wafer
Diameter: 200mm
Type/dopant: N or P
Orientation: <100>
Resistivity: 0-100 ohm-cm
Thickness: 725 +/-20um
TTV: < 5um
STIR: <2um
Notch: SEMI standard
Double Side Polished |
All 300mm silicon wafers are double side polished. FSM offers site flatness measurements down to <0.05um or greater, site size 26mmx 8 mm, 100% PUA.
Please
CONTACT FSM for further information on Double Side Polished Wafers or to discuss your current requirements.
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