Float Zone (FZ) silicon is commonly used in the manufacture of discrete power devices, high efficiency solar, RF chips and optical products. FZ silicon is a high purity alternative to Czochalski (CZ) grown silicon whereas the concentration of carbon and oxygen impurities are extremely low. The purity of FZ allows the silicon to go through a lighter doping process, sometimes producing resistivity measurements reaching heights of up to 50,000 ohm-cm.
FSM offers FZ wafers ranging in diameter from 50mm to 200mm. Intrinsic wafers are available. Below please find examples of FSM standard FZ wafer specifications.
Below are examples of FSM standard products:
Silicon Wafer
Diameter:150 mm
Type/dopant: N or P
Orientation: <100>
Resistivity: 1,000-3,000 ohm-cm
Thickness: 675 +/-25um
Flats: 1 / SEMI standard
TTV: <10 um
Front Side: Polished
Back Side: Etched or Polished
Please
CONTACT FSM for further information on Float Zone Wafers (FZ) or to discuss your current requirements.