研磨：
Lapping
FSM provides lapping services when there is a need to remove bulk amounts of silicon from a wafer substrate. Bulk silicon removal is often required in wafer reclaim and for thinning projects. FSM provides lapping for all wafer diameters 50mm to 300mm.
Please
CONTACT FSM for more information.
简体中文
Japanese(日语)
Korean(韩文)
English(英文)