FSM’s product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required. They are also needed for double side patterning and device manufacturing projects. 
FSM carries a large inventory of double side polished wafers in all wafer diameters ranging from 50mm to 300mm. If your specification is not available in inventory FSM can custom manufacture wafers to your unique specifications. Double Side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry. 
    
Below are examples of FSM standard products:
 
 

Silicon Wafer Diameter: 100mm Type/dopant: N or P  Orientation: <100> Resistivity: 0-100 ohm-cm Thickness: 525 +/-20um TTV: < 8um STIR: available upon request Flats: 1 or 2/ SEMI standard Double Side Polished

Silicon Wafer Diameter: 200mm Type/dopant: N or P Orientation: <100> Resistivity: 0-100 ohm-cm Thickness: 725 +/-20um TTV: < 5um STIR: <2um Notch: SEMI standard Double Side Polished

 
All 300mm silicon wafers are double side polished. FSM offers site flatness measurements down to <0.05um or greater, site size 26mmx 8 mm, 100% PUA.
 
Please CONTACT FSM for further information on Double Side Polished Wafers or to discuss your current requirements.