FSM does offer wafer polishing solutions.

The following polishing services are available:

·       Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)

·       Single side polishing (SSP)

·       Double side polishing through simultaneous or “flip” polishing techniques ( DSP)

·       Backside polishing

·       Kiss Polishing – Light polish which will remove minor surface scratches or defects

·       Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films

·       Typical Yield: >=95%

Wafer polishing is available on virgin or reclaim silicon wafer substrates. Please reference the WAFER RECLAIM section of this website for information on FSM’s wafer reclaim service solutions.

Please CONTACT FSM for more information.