Fine Silicon Manufacturing(shanghai) Ltd.(FSM )was established in 2008 and is headquartered in Shanghai's which located in Waigaoqiao Free Trade Zone.FSM is one of the earliest enterprises engaged in silicon wafer processing and sales in China.In 2015, the Japanese branch KOD Corporation was established in Tokyo.At present, FSM Group has two plants in Shanghai and Japan, with a monthly processing capacity of 100,000pcs 12inch silicon wafers.
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Company Establishment
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Plant Area
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Experience
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FSM can provide dummy wafers in various sizes from 2 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
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Test grade wafers come right below the prime grade wafers on the quality basis.
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FSM offers silicon thermal oxide wafers. These are the silicon wafers which have been through either a Wet Thermal Oxide, or a Dry Thermal Oxide process, to “grow” a Thermal Oxide, or Silicon Dioxide (Sio2), layer on the surface of the wafer.
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FSM does offer wafer polishing solutions.
2 production bases in the world (Shanghai, Tokyo)
Fine Silicon Manufacturing(shanghai) Ltd.(FSM )was established in 2008 and is headquartered in Shanghai's which located in Waigaoqiao Free Trade Zone.
FSM is one of the earliest enterprises engaged in silicon wafer processing and sales in China.
In 2015, the Japanese branch KOD Corporation was established in Tokyo.
At present, FSM Group has two plants in Shanghai and Japan, with a monthly processing capacity of 100,000pcs 12inch silicon wafers.
At the sales end, FSM, KOD and upstream domestic and oversea wafer makers, wafer reclaim house and downstream semiconductor foundary have stable and good cooperation, customers all over the domestic and foreign countries and regions.
The main business also expanded from single Dummy wafer to the agent of reclaim wafer house, providing wafer reclaim business from 6 -12 inch;
At the same time, we also provide Test and Dummy wafers of various sizes from the wafer maker.
FSM also provides customized coatings wafer in various sizes and film thickness, eg: Thermal oxide, PETEOS, LP-Nitride, PE SiN etc.
In the field of third-generation semiconductors, we are also active and currently offer various sizes of SiC, lithium tantalate/lithium niobate (LiTaO3 (LT) and LiNbO3 (LN)), glass wafers, etc.
