CNENJP
Product Manual
Product Introduction
Test grade wafers come right below the prime grade wafers on the quality basis.  However, they are incredibly similar to prime grade silicon wafers but are available at quite lower rates. The main difference between them is cleanliness and flatness characteristics possessed by test grade wafers. In other words, the test grade silicon wafers are less rigorous as compared to prime grade wafers.  Overall, test grade wafers are prime grade wafers with few non-complaints features. Applications Of Test Grade Wafers
Parameter Specification

150MM/200MM

150MM
SPEC 0.2um≤30ea 0.2um≤30ea
Diameter(mm) 150±0.2mm 150±0.2mm
Type P P
Oval length 57.5mm±2.5mm 47.5mm±2.5mm
Resistance(Ω・cm) 1-100 1-100
Thickness(μm) SEMI JEIDA
675um±25um 675um±25um
TTV(μm) ≤ 30um ≤ 30um
BOW(μm) ≤ 40um ≤ 40um
WARP(μm) ≤ 40um ≤ 40um
Surface ≤5.0E 10 atom/cm2 ≤5.0E 10 atom/cm2


200MM
SPEC 0.2um≤30ea –
Diameter(mm) 200±0.2mm 200±0.2mm
Type P P
Notch orientation <110>±1 <110>±1
Resistivity (Ω・cm) 1-100 1-100
Thickness (μm) 725±25 725±25
TTV(μm) ≦25 ≦2
BOW(μm) ≤ 40um ≤ 40um
WARP(μm) ≤ 40um ≤ 40um
Surface ≤5.0E 10 atom/cm2 ≤5.0E 10 atom/cm2


Test grade wafers are high-quality wafers with fewer specifications than production grade wafers.

These wafers are used to monitor the performance and status of a semiconductor process step. Test grade wafers can provide a more economical solution for isolated testing.

For more information or a quote, please contact FSM.