FSM&KOD invites you to join us at the 2025 SEMICON CHINA exhibition

Since its inception in Shanghai in 1988, SEMICON China has grown to become one of the premier semiconductor industry events in China, encompassing the world's leading equipment and materials manufacturers in the field of semiconductor manufacturing. SEMICON China 2025 is set to embark once again, showcasing the latest technological trends and applications in the semiconductor industry through an exhibition coupled with multiple forums.

Fine Silicon Manufacturing(shanghai) Ltd.(FSM) will jointly exhibit at this grand event with its Japanese subsidiary, KOD Corporation. We sincerely invite you to visit our booth at Hall E6, Booth 156, to explore the future development trends of the semiconductor industry together. We appreciate your attention and support for FSM and look forward to meeting you at SEMICON China!

Booth Number: Hall E6 - Booth 156
Date: March 26th - March 28th, 2025
Venue Address: Shanghai New International Expo Center

Exhibition Hall Floor Plan

E6 Hall - FSM Booth (156) Layout Diagram

Company Introduction

Fine Silicon Manufacturing(shanghai) Ltd.(FSM ) was established in 2008 and is headquartered in the Waigaoqiao Free Trade Zone in Shanghai. FSM is one of the earliest enterprises in China engaged in silicon wafer processing and sales. In 2015, FSM established its Japanese subsidiary, KOD Corporation, located in Tokyo. Currently, the FSM Group operates two processing plants in Shanghai and Japan, with a monthly processing capacity of 100,000 12-inch monocrystalline silicon wafers.

The company's main business has expanded from its initial focus on Dummy wafers to include the representation of reclaim wafer houses, offering wafer reclaim services for 6-inch, 8-inch, and 12-inch wafers. Additionally, FSM provides various sizes and specifications of Test, Control, and Dummy wafers from both domestic and international silicon wafer manufacturers. FSM also undertakes customized coating services, offering coated wafers in various sizes and thicknesses, including Thermal oxide, PETEOS, LP-Nitride, PE SiN, W, ECP-Cu, AL, PR, and more.

In the field of third-generation semiconductors, FSM is actively developing its business and currently offers various sizes of SiC, lithium tantalate/lithium niobate (LiTaO3 (LT) and LiNbO3 (LN)), and glass wafers.

Traffic Guide

From Pudong International Airport
- Take the Maglev Train to Longyang Road Station, then transfer to Line 7 and ride one stop to Huamu Road Station.  
- Take Metro Line 2 to Longyang Road Station, then transfer to Line 7 and ride to Huamu Road Station.  

From Hongqiao Airport/Hongqiao Railway Station
- Take Metro Line 2 to Longyang Road Station, then transfer to Line 7 directly to Huamu Road Station.  

From Shanghai Railway Station
- Take Metro Line 4 to Century Avenue Station, transfer to Line 2 to Longyang Road Station, then transfer to Line 7 directly to Huamu Road Station.